VORAGO Technologies announces family expansion and size reduction of radiation-hardened Arm® Cortex® MCUs into BGA packages for Defense and Aerospace

AUSTIN, Texas - EntSun -- VORAGO Technologies (https://voragotech.com) today announced the expansion of the highly integrated Radiation-Hardened Arm^® Cortex^® Microcontroller (MCU) family into Ball Grid Array packages. This announcement promises an increase of functionality options spanning size and scope while incorporating the company's patented HARDSIL^® technology.

"As the space market transitions into smaller electrical designs, the need for a reduction in Size Weight and Power, or SWaP, of the components building those systems need to follow suit. The introduction of the VORAGO family of BGA processors allows the functionality of up to 8 ICs to be compressed down into one tiny 12x12mm BGA package." – Jason Wells, Director of Product Management, VORAGO Technologies

More on EntSun News

• Century Fasteners de Mexico Exhibiting at the 2026 Automotive & Aerospace Nearshoring Summit
• Lovecraft In Florida Blu-Ray Release
• Retell AI White Label Platform for Agencies Launched by VoiceAIWrapper, With Branded Client Portals and No Per-Minute Markup
• Events by Dubsdread Celebrates Cultural Traditions with New Guide on Faith-Based Wedding Traditions Across Cultures
• FOCUS Names Mark Phillips Senior Vice President of Business Development

The expansion of packages for VA416XX and VA108X0 offers unprecedented choice in a marketplace dominated by limited, less-flexible legacy components. These new additions to the broader family of Arm^® Microcontroller products from VORAGO drastically reduce the design footprint while offering more flexibility with applications in hi-rel, aerospace, military and defense.

VA416XX and VA108X0 family of products include the following features and benefits:

• High performance Arm^® Cortex^® processing power with easy-to-use programming tools
• Optional integrated NVM to take up less real estate
• Pin-to-pin compatibility across family of MCUs
• 12x12mm BGA package increasing available board space
• Full Latch-up immunity and TID up to 300 krad (Si) utilizing VORAGO's patented HARDSIL^® technology
• Broad range of communication interfaces (I²C, UART, CAN, SPI, Ethernet, Spacewire)
• Easy-to-design development kit, with exceptional support and service offerings available
• To learn more or request a datasheet, visit VORAGO's Product Page.

About VORAGO Technologies

More on EntSun News

• Get The Led Out Bring an Outstanding Tribute to Led Zeppelin to the Weinberg Center
• Cemetery Cinema is now available for Syndication!!!!
• Notaron Expands Online Notarization Access Following Wisconsin Approval
• Michelle Carey Releases Maryland Political Thriller, The Crofton Triangle
• Before Drake Was Drake, Detroit-Raised KayeDinero Was Already Watching Aubrey Graham

VORAGO Technologies is a privately held, high technology company based in Austin, Texas with over 14 years of experience in providing radiation-hardened and extreme-temperature solutions for the Hi-rel marketplace. VORAGO's patented HARDSIL^® technology uses cost-effective high-volume manufacturing to harden any commercially designed semiconductor component for extreme environment operation, and has created a number of solutions throughout Aerospace, Defense and Industrial applications. VORAGO Technologies opens up a new world of possibilities for your designs, no matter how hostile the environment. www.voragotech.com