Popular on EntSun
- IQSTEL Enters 2026 from a Position of Strength Following Transformational Year Marked by N A S D A Q Uplisting, Record Revenue and First-Ever - 142
- "Phinge Unveil™" Coming to Las Vegas to Showcase Netverse Patented Verified App-less Platform, AI & Modular Hardware Including Developer Conferences - 126
- David Boland, Inc. Awarded $54.3M Construction Contract by U.S. Army Corps of Engineers, Savannah District - 117
- AI-Driven Drug Development with Publication of New Bioinformatics Whitepaper for BullFrog AI: $BFRG Strengthens Its Position in AI Drug Development - 115
- International Law Group Expands Emergency Immigration Consultations for Somali Minnesotans Amid ICE Actions - 115
- $26 Billion Global Market by 2035 for Digital Assets Opens Major Potential for Currency Tech Company with ATM Expansion and Deployment Plans Underway - 114
- Lick Personal Oils Introduces the Ultimate Valentine's Day Gift Collection for Romantic, Thoughtful Gifting - 114
- Java Holdings LLC Acquires +Peptide, Expanding Portfolio Across Coffee, Science, and Functional Nutrition - 109
- Upcoming Movies: 360 Sound And Vision Releases It's Slate Of Movies For 2026 - 108
- ANTOANETTA Partners With Zestacor Digital Marketing to Expand Online Presence for Handcrafted Luxury Jewelry - 105
Similar on EntSun
- MITSUYA PLATING Expands ONE-STOP Service for US-based Medical Device, Semiconductor and Aerospace Manufacturers
- Voiset AI Planner Launches Smart Booking: Real Estate Agents, ADHD Coaches, Sales Teams End Calendar Chaos
- The Ms. Corporate America Maryland Competition Returns for an Unforgettable Evening of Leadership, Excellence, and Empowerment
- Precision Adult Care Expands 24/7 Adult In-Home Care Services to Meet Growing Demand in the Coachella Valley
- Openchannelflow Wins Web Excellence Award for Outstanding Digital Experience
- UK Financial Ltd Lists MayaFund (MFUND) ERC-20 Token on CATEX Exchange Ahead of Planned ERC-3643 Upgrade
- Roblox and Solsten Alliances; a Stronger Balance Sheet and Accelerated Growth Through AI, Gaming, and Strategic Partnerships for Super League: $SLE
- Scoop Social Co. Partners with Fairmont Hotels & Resorts to Elevate Summer Guest Experiences with Italian Inspired Gelato & Beverage Carts
- Building a $145M AI-Powered Marine Platform as Listings Surge, Global Expansion Begins, OTH Shares Trade at a Discount: Off The Hook YS (N Y S E: OTH)
- Americans Need $1.26 Million to Retire But Have Just $38K Saved — So They're Building Income Instead
Enabling next-gen architectures: TE Connectivity showcases data and power connectivity solutions at OCP Summit
EntSun News/10810039
HARRISBURG, Pa., Feb. 14, 2020 /PRNewswire/ -- TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, will showcase a broad range of data and power connectivity products in booth A17 at the 2020 Open Compute Project (OCP) US Summit March 4-5 at the San Jose Convention Center.
TE is a vertically-integrated supplier delivering high-performance data and power connectivity solutions. The company's products have been incorporated into server, storage, networking and artificial intelligence (AI) products across the OCP show floor. TE will display innovative power solutions along with solutions for internal input/output (I/O), external I/O, board-to-board connectivity, and socket connectivity. TE experts will be on hand to show attendees how these solutions can address a wide variety of applications in next-generation products based on OCP reference designs. TE's showcase will include:
Internal interconnects: Internal high speed cable and connector solutions can achieve about one-third the loss or three times the reach of advanced printed circuit board routing. Coupled with our Sliver interconnects and STRADA Whisper connector technologies, these solutions can support the performance needed to address next-generation 56G and 112G lanes. TE's high-performance internal interconnects address the needs for high data rates with robust signal integrity and power delivery through mateing/unmateing, including blind-mate service operations commonly found in data center production environments. TE supports jacketed, stranded and sheathed cable solutions to address the bend radius requirements for cable installation and management.
More on EntSun News
External interconnects: TE continues to be a leader in the industry with I/O solutions for 56G- and 112G-based interconnect solutions supporting 50G, 100G, 200G and 400G links from the data center server, through fabric and spine network layers and equipment for wide-area-network, data center-to-data center connections. The company's solutions not only address the needs for high data rates but can also provide reliable, high-density, compatible solutions for robust interoperability. TE's high-performance cable assemblies can be tailored to support the mechanical and electrical requirements for many applications.
Power solutions: TE's power connectors, cable assemblies and value-added busbar solutions can provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level busbar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.
Board-to-board and socket: High performance board-to-board products address the need for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE's socket portfolio includes standard CPU sockets and custom CPU sockets to help customers that want to incorporate their own semiconductor technology and memory interconnects.
More on EntSun News
Learn more and schedule a meeting with one of our experts on TE's 2020 Open Compute Project (OCP) Global Summit events page.
ABOUT TE CONNECTIVITY
TE Connectivity is a $13 billion global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With nearly 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.
Sliver, STRADA Whisper, TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks owned or licensed by the TE Connectivity Ltd. family of companies. Other logos, product(s) and/or company names might be trademarks of their respective owners.
SOURCE TE Connectivity
Related Links
www.te.com
TE is a vertically-integrated supplier delivering high-performance data and power connectivity solutions. The company's products have been incorporated into server, storage, networking and artificial intelligence (AI) products across the OCP show floor. TE will display innovative power solutions along with solutions for internal input/output (I/O), external I/O, board-to-board connectivity, and socket connectivity. TE experts will be on hand to show attendees how these solutions can address a wide variety of applications in next-generation products based on OCP reference designs. TE's showcase will include:
Internal interconnects: Internal high speed cable and connector solutions can achieve about one-third the loss or three times the reach of advanced printed circuit board routing. Coupled with our Sliver interconnects and STRADA Whisper connector technologies, these solutions can support the performance needed to address next-generation 56G and 112G lanes. TE's high-performance internal interconnects address the needs for high data rates with robust signal integrity and power delivery through mateing/unmateing, including blind-mate service operations commonly found in data center production environments. TE supports jacketed, stranded and sheathed cable solutions to address the bend radius requirements for cable installation and management.
More on EntSun News
- Three Italian Tenors to Perform in Fort Myers, Florida
- Voiset AI Planner Launches Smart Booking: Real Estate Agents, ADHD Coaches, Sales Teams End Calendar Chaos
- Falling in Love with Winter Eyewear Trends: The Best Glasses of the Season
- Max Tucci Makes His Highly-Anticipated Debut On QVC—unveiling A Bespoke Luxury Chocolate Collection Inspired By 100 Years Of Tucci Hospitality
- Clika Casting Director Paul Sinacore on Authentic Casting and Building Culturally Rooted Studio Films
External interconnects: TE continues to be a leader in the industry with I/O solutions for 56G- and 112G-based interconnect solutions supporting 50G, 100G, 200G and 400G links from the data center server, through fabric and spine network layers and equipment for wide-area-network, data center-to-data center connections. The company's solutions not only address the needs for high data rates but can also provide reliable, high-density, compatible solutions for robust interoperability. TE's high-performance cable assemblies can be tailored to support the mechanical and electrical requirements for many applications.
Power solutions: TE's power connectors, cable assemblies and value-added busbar solutions can provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level busbar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.
Board-to-board and socket: High performance board-to-board products address the need for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE's socket portfolio includes standard CPU sockets and custom CPU sockets to help customers that want to incorporate their own semiconductor technology and memory interconnects.
More on EntSun News
- The Ms. Corporate America Maryland Competition Returns for an Unforgettable Evening of Leadership, Excellence, and Empowerment
- 3 Percent Global Expands Its Independent Music Operations on a Global Scale
- Independent Artist Slyide Turning Heads Around The World
- Precision Adult Care Expands 24/7 Adult In-Home Care Services to Meet Growing Demand in the Coachella Valley
- Metavalis Launches Massive Community Coat Drive in Branson to Support Local Residents
Learn more and schedule a meeting with one of our experts on TE's 2020 Open Compute Project (OCP) Global Summit events page.
ABOUT TE CONNECTIVITY
TE Connectivity is a $13 billion global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With nearly 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.
Sliver, STRADA Whisper, TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks owned or licensed by the TE Connectivity Ltd. family of companies. Other logos, product(s) and/or company names might be trademarks of their respective owners.
SOURCE TE Connectivity
Related Links
www.te.com
Filed Under: Business
0 Comments
Latest on EntSun News
- Mystery Enterprises™ Announces February 27 Launch of Its Automated Murder Mystery Games™
- UK Financial Ltd Lists MayaFund (MFUND) ERC-20 Token on CATEX Exchange Ahead of Planned ERC-3643 Upgrade
- Denver Apartment Finders Launches Revamped Denver Tech Center Apartment Location Page
- Roblox and Solsten Alliances; a Stronger Balance Sheet and Accelerated Growth Through AI, Gaming, and Strategic Partnerships for Super League: $SLE
- Boston Industrial Solutions' Natron® 512N Series UV LED Ink Earns CPSIA Certification
- For Valentine's Day: Treat yourself (and maybe even your sweetheart) to some Not Exactly Love Poems
- Power Business Solutions Announces Joint Venture with EIG Global Trust to Deliver Data Center Financial Solutions
- Scoop Social Co. Partners with Fairmont Hotels & Resorts to Elevate Summer Guest Experiences with Italian Inspired Gelato & Beverage Carts
- Buildout Launches Native Email Marketing Feature, Expanding Its End-to-End CRE Platform
- Fashion Sourcing: Setting the Standard in Premium Golf Apparel
- New Saxophone Prize Honors Astronaut Ronald E. McNair, First To Play Sax In Space
- Building a $145M AI-Powered Marine Platform as Listings Surge, Global Expansion Begins, OTH Shares Trade at a Discount: Off The Hook YS (N Y S E: OTH)
- American Disabilities Act Must Protect Against Forced Psychiatric Commitment and Treatment
- 2025 Top Lawyers - ELA Awards by Expert Law Attorneys
- Top Law Firms In 2025 - Expert Law Attorneys
- Best Personal Injury Attorneys Of 2025 - ELA Awards
- Best Personal Injury Law Firms 2025 - ELA Awards
- Baruch Arcade Launches AI-Powered Gaming Platform on Solana, do I smell an airdrop?
- Expert Law Attorneys 2025 Best Attorneys
- Best Family Law Attorneys Of 2025 - ELA Awards