BHV Returns to IBC with Expanded Portfolio of Design and Engineering Services and an Upgraded Chip

EntSun -- Company will also highlight new alliance with L2Tek that brings significant advantages to customers

Massachusetts, 24 July 2023 - BHV, provider of turnkey engineering services, will be back at IBC with its expanded portfolio of design and manufacturing services for hardware, firmware, desktop, and cloud solutions. In addition to its extensive range of in-house and outsourced engineering services, the Company will be showcasing its significantly upgraded TV studio in a Chip solution that now includes 4K 60 rendering and image manipulation and will present a range of wireless and control technologies in Hall 10 on Stand A.20.

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BHV will also be highlighting its new alliance with L2Tek, a Silicon supplier recently appointed to represent BHV's value-added services to the video sector with special emphasis on image rendering and processing. The alliance will offer greater support for clients looking to develop video solutions, buttressed by significant levels of integration with component manufacturers. Executives from both companies will be available to discuss the benefits the relationship brings to customers.

"BHV has now expanded with locations in the US as well as in Europe to provide better support for the key international brands we serve," said Bill Garrett. "As part of this development strategy, we are delighted to establish this relationship with L2Tek that will offer significant advantages to our clients and play a key role in our continued growth."